By lcd manufacturer | 10 July 2018 | 0 Comments
COG、FOG、COB、COF、TAB Product analysis
What are the differences among COG, FOG, COB, COF, TAB lcds?
COG is English, "Chip On Glass" acronym, the chip is directly bound to the glass. This installation can greatly reduce the volume of the entire LCD module, and easy to mass production, suitable for consumer electronic products for LCD, such as: mobile phones, PDA and other portable electronic products. This installation, driven by IC manufacturers, will be the main connection between IC and LCD in the future. COG stands for Chip on Glass. There are many different types of displays. COB (Chip on Board), COF (Chip on Flex), TAB (Tape automated bonding) and COG. This is an LCD technology where the controller chip used to drive the LCD is mounted directly onto the LCD glass. Mounting the controller directly onto the LCD glass allows the module to be built without the need for a PCB. The three main components of a chip on glass is the glass, the controller driver chip, and the cable. As a general rule the cost of a COG is less than that of a COB. Without being mounted to a circuit board, COG displays do not come equipped with mounting holes. Instead the COG display is mounted to the chassis if the manufacturer’s product uses double-sided tape.
FOG is English, "Film On Glass" acronym, the FPC is directly bound to the glass.
COB is the abbreviation of English "Chip On Board", that is, the chip is fixed (Bonding) on the PCB, which can save the PCB board and other materials, can greatly reduce the volume, at the same time, the price can also reduce the cost. Since IC manufacturers are reducing the production of QFP (SMT) packages in LCD control and related chip production, the traditional SMT approach will be gradually replaced in future products.
COF is English, "Chip On Film" acronym, the chip is directly installed on the flexible PCB. This connection has a high degree of integration, and the peripheral components can be installed on the flexible PCB with IC.
TAB is the abbreviation of English "Tape Aotomated Bonding", that is, anisotropic conductive adhesive bonding. The IC encapsulated in TCP (Tape Carrier Package carrying package) is fixed on LCD and PCB by anisotropic conductive adhesive, respectively. This installation method can reduce the LCM weight, volume, convenient installation, high reliability!
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